TOKYO, JAPAN, July 13, 2005 - Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started shipping samples of small form-factor, 512 Megabit Mobile RAM devices for high-performance, 3G cellular applications. By utilizing 90 nm process technology, Elpida can now offer customers 512 Megabit Mobile RAM devices with a smaller and square die for easier implementation into Multi-Chip Package (MCP) and System-in-Package (SiP) designs which require 11 x 11 mm packages or smaller to save valuable board space. Read more at Elpida.
Monday, July 18, 2005
Elpida Memory's 512 Megabit Mobile RAM Device Fits in Smaller Package for 3G Phones
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